The effect of stabilizers on electroless copper plating from Saccharose-containing methane sulphonate baths

The effect of addition of 2-Mercaptobenzothiazole (2-MBT), Thiourea, N-Methyl thiourea and 2,2’-dipyridyl on electroless copper deposition from a methane sulphonate bath are studied. Saccharose and Para formaldehyde are used as the complexing and reducing agents respectively. All the stabilizers are found to improve the bath stability and produce the quality deposits. Of the four stabilizers studied, 2,2’-dipyridyl produces brightest copper deposits with more compact and finer sized crystals than other stabilizers. The crystal structure and surface morphology are observed and supported by SEM, AFM and XRD studies.